Low MOQ for optical to ethernet converter - Polyamide – GELD
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Low MOQ for optical to ethernet converter - Polyamide – GELD Detail:
By selecting specific monomers, one can achieve a crystallizable and permanently transparent polyamide. The crystallites are so small that they do not scatter visible light, and the material appears transparent to the human eye—a property known as microcry stallinity. Because of its crystallinity, the microcrystalline structure retains important properties such as stress cracking resistance — without clouding. The degree of crystallinity is so negligible, however, that it has no adverse effect on the shrinkage behavior of molded parts. It undergoes a similar isotropic shrinkage like amorphous materials.
It is a low-viscous, permanently transparent polyamide for injection molding.
Character |
Good dimensional stability |
Good UV resistance |
Good workability |
Impact resistance high |
Low temperature impact resistance |
||
Good chemical resistance |
Low contractility |
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Application |
engineering application |
optical applications |
|
cable level |
applications in the automotive field |
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Apprearance |
the available color |
transparent |
natural color |
Shape |
particle |
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Processing Method |
extrusion molding |
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Physical Properties |
Rated Value |
Unit |
Test Method |
Density (23°C) |
1.02 |
g/cm³ |
ISO 1183 |
Viscosity Number |
> 120 |
cm³/g |
ISO 307 |
Hardness |
Rated Value |
Unit |
Test Method |
Shaw Hardness (Shaw D) |
81 |
|
ISO 868 |
Ball Indentation Hardness |
110 |
MPa |
ISO 2039-1 |
Mechanical Property |
Rated Value |
Unit |
Test Method |
Tensile Modulus (23°C) |
1400 |
MPa |
ISO 527-2 |
Tensile stress (yield, 23°C) |
60.0 |
MPa |
ISO 527-2/50 |
Tensile strain (yield, 23°C) |
8.0 |
% |
ISO 527-2/50 |
Nominal tensile fracture strain (23°C) |
> 50 |
% |
ISO 527-2/50 |
Flexural Modulus |
1500 |
MPa |
ISO 178 |
Bending Stress 1 |
|
|
ISO 178 |
3.5% Strain |
50.0 |
MPa |
ISO 178 |
– |
90.0 |
MPa |
ISO 178 |
Outer Fiber Strain – at maximum stress 2 |
> 10 |
% |
ISO 178 |
Impact Property |
Rated Value |
Unit |
Test Method |
Charpy Notched Impact Strength |
|
|
ISO 179/1eA |
- 30°C, Completely broken |
10 |
kJ/m² |
ISO 179/1eA |
0°C, Completely broken |
11 |
kJ/m² |
ISO 179/1eA |
23°C, Completely broken |
11 |
kJ/m² |
ISO 179/1eA |
Charpy Impact Strength |
|
|
ISO 179/1eU |
-30°C |
No breakage |
|
ISO 179/1eU |
0°C |
No breakage |
|
ISO 179/1eU |
23°C |
No breakage |
|
ISO 179/1eU |
Thermal properties |
Rated Value |
Unit |
Test Method |
Heat Deflection Temperature | |||
0.45 MPa, unannealed |
120 |
°C |
ISO 75-2/B |
1.8 MPa, unannealed |
102 |
°C |
ISO 75-2/A |
Glass Transition Temperature 3 |
132 |
°C |
ISO 11357-2 |
Vicat Softening Temperature | |||
– |
132 |
°C |
ISO 306/A |
– |
125 |
°C |
ISO 306/B |
Linear thermal expansion coefficient |
|
|
ISO 11359-2 |
Flow : 23 TO 55°C |
9.0E-5 |
cm/cm/°C |
ISO 11359-2 |
Horizontal : 23 TO 55°C |
9.0E-5 |
cm/cm/°C |
ISO 11359-2 |
Electrical Properties |
Rated Value |
Unit |
Test Method |
Surface Resistivity |
1.0E+14 |
ohms |
IEC 60093 |
Volume Resistivity |
1.0E+15 |
ohms·cm |
IEC 60093 |
Relative Permittivity |
|
|
IEC 60250 |
23°C, 100 Hz |
3.40 |
|
IEC 60250 |
23°C, 1 MHz |
3.30 |
|
IEC 60250 |
Dissipation Factor |
|
|
IEC 60250 |
23°C, 100 Hz |
0.013 |
|
IEC 60250 |
23°C, 1 MHz |
0.022 |
|
IEC 60250 |
Leakage mark index |
|
|
IEC 60112 |
4 |
575 |
V |
IEC 60112 |
– | |||
Solution A |
600 |
V |
IEC 60112 |
Flammability |
Rated Value |
Unit |
Test Method |
UL flame retardant rating |
|
|
UL 94 |
0.800 mm |
HB |
|
UL 94 |
1.60 mm |
HB |
|
UL 94 |
Scorching wire flammability index (1.00 mm) |
960 |
°C |
IEC 60695-2-12 |
Hot filament ignition temperature(1.00 mm) |
825 |
°C |
IEC 60695-2-13 |
Remarks | |||
1 |
5.0 mm/min |
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2 |
5.0 mm/min |
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3 |
10 K/min |
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4 |
100 drops value |
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5 |
extrusion temperature 250–280℃ |
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